Different IC Package types

Have you been getting into PCB design, and got introduced to a world of IC packages? This guide will showcase some of the major different packages that IC’s come in, and the different applications of them!

DIP

DIP is probably what you’re familiar with. It’s the breadboard compatible size that you’ve been using in ECE 210, and other classes. Because of it’s breadboard compatibility, it’s easy to prototype with, and as we’ll see later, we can break out smaller components into a DIP package for testing purposes. They are also through hole (THT), which allows them to slot into breadboards, and prototyping PCB’s.

An example of a DIP packaged IC

SMD

SMD is a cheaper, and smaller way to package IC’s using exposed copper pads which an IC can lay on instead. This is more efficient for automating PCB building, as pick and place machines can easily place IC’s at the correct locations, and techniques such as stenciling make it faster to mass produce a PCB with SMD components instead of DIP/THT components.

Breakout Boards

As mentioned earlier, it’s easier to prototype using breakout boards, which can turn a SMD packaged component into a DIP style component. This means we can test our components on a breadboard, before soldering them to the PCB.

A variety of SMD breakout boards

SOIC

This is the term associated with small form factor SMD IC packages, which originated as a more compact way to design an IC compared to the DIP counter part.

An SOIC next to a DIP IC

SOP

Another common example of an SMD chip is an SOP package size chip. These are a type of SOIC package, and offer a compact way to design a PCB.

There are many more sub variants of these packages, like TSSOP, VSSOP, and many more. These all over unique ways to structure a PCB, and allow you the creativity in designing a layout for your project. Hopefully, this guide showcased the different kinds of packages that IC’s come in, and the different sizes that you could use for your next project!